From sand to chips

From a handful of sand that can be easily lifted to an indispensable chip in various industries, it requires a very complex processing program. one Extraction and purification of silicon 2 Making Silicon Ingots 3 Cutting silicon ingots 4 Photolithography 5 Etching and deposition 6 Testing and packaging.

The unit is designed for unsupervised public use: controls are recessed or shielded, moving parts are enclosed, and the interface is operable by a child of about six with no instruction. Where a screen is used, the language can be switched without changing the hardware, and the content can be replaced on site.

The semiconductor material used in chips is monocrystalline silicon. Sand needs to be refined into pure silicon ingots with a purity of 99.99% or higher. After silicon melting, purification, high-temperature shaping, and rotation stretching, the sand will become monocrystalline silicon rods. After cutting, rolling, slicing, chamfering, and polishing, silicon wafers can be obtained, which are the basic materials for manufacturing semiconductor chips. The production process of monocrystalline silicon slicing involves more than ten techniques, mainly including slicing, chamfering, cleaning, polishing, testing, and packaging. Slicing refers to cutting a single crystal silicon rod into thin pieces with precise geometric dimensions. With this thin silicon wafer, we can truly enter the manufacturing process of integrated circuits. On each wafer, tens of thousands of chip circuits can be implemented, and each small cell on the wafer is a physical implementation of a chip circuit, called a grain. Observing the wafer under a microscope, it was found that the surface of the wafer was covered with crisscrossing 3D circuits. On the chip.